{ this.isMonthlyProductLoading = false; }, 3000);}if (this.isAnnualProductLoading) {window.setTimeout(() = { this.isAnnualProductLoading = false; }, 3000);}}},}" x-effect="if ((monthlyIntroductoryProduct?.isReady && monthlyIntroductoryProduct?.isEligible) || (monthlyIntroductoryProduct?.isReady && monthlyDefaultProduct?.isReady)) {isMonthlyProductLoading = false;}if ((annualIntroductoryProduct?.isReady && annualIntroductoryProduct?.isEligible) || (annualIntroductoryProduct?.isReady && annualDefaultProduct?.isReady)) {isAnnualProductLoading = false;}"
以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
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"These deals mostly increase Reddit's visibility and strategic importance, rather than being the original reason people use it," says Oc.